LTCC

· 1] Raymond Brown, “LTCC-Bringing Functional Integration to RF & Microwave Products” http://www.national.com/appinfo/ltcc
· [2] R. G. Pond, C. J. Sabo, W. A. Vitriol, and R. L. Brown, “Processing and Reliability of Resistors Incorporated Within Low Temperature Cofired Ceramic Structures,” in Proc. of the International Symp. On Microelectronics, International Soc. for Hybrid Microelectronics, Atlanta, pp.461-465 (1986).
· [3] S. Tosaka, K. Hoshi, T. Honda, et al.., “Properties of Low Temperature Cofired Multilayer Ceramic Substrates with Buried Passive Components,” in Proc. 4th International Microelectronics Conf., p.83(1988).
· [4] Y. Yoshiyuki, S. Nakai, K. Kawamura, M. Kobayashi, “A Miniaturized VCO Using Multi-Layer Ceramic Technology,” in Proc. International Microelectronics Conf. pp.309-313(1992).
· [5] H. D. Smith, R. F. McClanahan, A. A. Shapiro, and G. Pelzman, “Via Capacitors Within Multi-Layer, 3 Dimensional Structures/Substrates,” U. S. Patent 5,055,966(8 Oct 1991).
· [6] H. D. Smith, R. F. McClanahan, A. A. Shapiro, and R. L. Brown, “Via Resistors Within Multi-Layer, 3 Dimensional Substrates/Structures,” U. S. Patent 5,164,699(17 Nov 1992).
· [7] “DuPont Green TapeTM Design and Layout Guideline” http://www.dupont.com/mcm/gtapesys
· [8] 박성대, 강현규, 박윤휘, 문제도, “Multichip module 개발을 위한 LTCC 및 LTCC M 기술,” 마이크로전자 및 패키징학회지, 제6권 제3호, pp.25-35(1999).
· [9] W. K. Jones, Y. Liu, B. Larsen, P. Wang and M. Zampino, “Chemical, Structural and Mechanical Properties of the LTCC Tapes,” in Proc. 2000 International Symp. on Microelectronics(2000).